| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| DS1216C | DAL | 08+ | 3 | 2026-04-30 | ||||
| NL6448BC26-09C | NEC/日电电子 | 09+ | 1 | 2026-04-30 | ||||
| MKL27Z256VFT4 | NXP/恩智浦 | QFN | 23+ | 1300 | 2026-04-30 | |||
| ATA6826C-TUQW | MICROCHIP/微芯 | 18+ | 1008 | 2026-04-30 | ||||
| PIC16F1783T-I/SS | MICROCHIP/微芯 | 18+ | 1008 | 2026-04-30 | ||||
| MCP6002T-I/MS | MICROCHIP/微芯 | MSOP8 | 22+ | 50000 | 2026-04-30 | |||
| USB3320C-EZK-TR | MICROCHIP/微芯 | QFN32 | 18+ | 5000 | 2026-04-30 | |||
| K6R4016C1D-KI10 | SAMSUNG/三星 | SOJ44 | 11+ | 435 | 2026-04-30 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| XC17256EPDG8C | XILINX/赛灵思 | DIP | 10+ | 683 | 2026-04-30 | |||
| CGS74LCT2524MX | NS/美国国半 | 00+ | 312 | 2026-04-30 | ||||
| LH79520-N0M-000 B1 | SHARP/夏普 | 04+ | 160 | 2026-04-30 | ||||
| MSP430F2252IRHAR | TI/德州仪器 | 11+ | 150 | 2026-04-30 | ||||
| UDN2580A | ALLEGRO/美国埃戈罗 | DIP | 91+ | 50 | 2026-04-30 | |||
| UPD6450CX-002 | NEC/日电电子 | 00+ | 70 | 2026-04-30 | ||||
| MSP430F149IPM | TI/德州仪器 | 16+ | 45 | 2026-04-30 | ||||
| MKL27Z256VFT4 | NXP/恩智浦 | QFN | 23+ | 1300 | 2026-04-30 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| XC2V3000-4BF957C | XILINX/赛灵思 | 06+ | 5 | 2026-04-30 | ||||
| XC1736EPC | XILINX/赛灵思 | 98+ | 7 | 2026-04-30 | ||||
| XC1736EPD8C | XILINX/赛灵思 | 99+ | 7 | 2026-04-30 | ||||
| 88SE9215A1-NAA2C000 | MARVELL/迈威 | 15+ | 10 | 2026-04-30 | ||||
| XC2S150-5FG456C | XILINX/赛灵思 | 06+ | 12 | 2026-04-30 | ||||
| NH82801HO SL9MM | INTEL/英特尔 | 07+ | 10 | 2026-04-30 | ||||
| AM79C875KC | ADVANCED MICRO DEVICES | 01+ | 25 | 2026-04-30 | ||||
| PC28F128P30T85 | INTEL/英特尔 | 08+ | 25 | 2026-04-30 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| K6R4016C1D-KI10 | SAMSUNG/三星 | SOJ44 | 11+ | 435 | 2026-04-30 | |||
| MC68HC000FN8 | MOTOROLA/摩托罗拉 | 96+ | 8 | 2026-04-30 | ||||
| MM58174AN | NS/美国国半 | 93+ | 15 | 2026-04-30 | ||||
| JS28F128J3F75A | MICRON/美光 | 17+ | 25 | 2026-04-30 | ||||
| KU80386EXTC25 | INTEL/英特尔 | 97+ | 25 | 2026-04-30 | ||||
| XCF5206EFT40 | MOTOROLA/摩托罗拉 | 00+ | 35 | 2026-04-30 | ||||
| AM27C128-150/BXA | ADVANCED MICRO DEVICES | 95+ | 37 | 2026-04-30 | ||||
| P80C51FA | INTEL/英特尔 | 03+ | 13 | 2026-04-30 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| BD9778HFP-TR | ROHM/罗姆 | 04+ | 50 | 2026-04-30 | ||||
| KTB1124-B-RTF/P | KEC/开益禧 | 09+ | 6000 | 2026-04-30 | ||||
| KTD1624-B-RTF/P | KEC/开益禧 | 07+ | 6000 | 2026-04-30 | ||||
| BC847BW | PHILIPS/飞利浦 | 04+ | 850 | 2026-04-30 | ||||
| 2SK880-Y | TOSHIBA/东芝 | 19+ | 1000 | 2026-04-30 | ||||
| BC807-25 E6327 | Infineon/英飞凌 | 05+ | 2200 | 2026-04-30 | ||||
| BAS70-04W E6327 | Infineon/英飞凌 | 05+ | 2600 | 2026-04-30 | ||||
| 2SD2170 T100 | ROHM/罗姆 | 02+ | 3900 | 2026-04-30 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| EPCS64SI16N | ALTERA/阿尔特拉 | 12+ | 17 | 2026-04-30 | ||||
| MT47H256M8EB-25E:C | MICRON/美光 | 11+ | 200 | 2026-04-30 | ||||
| AT89C51RC2-RLTUL | ATMEL/爱特梅尔 | 10+ | 231 | 2026-04-30 | ||||
| AT45DB081D-SU | ATMEL/爱特梅尔 | 10+ | 595 | 2026-04-30 | ||||
| W25Q128BVFG | WINBOND/华邦 | 11+ | 1000 | 2026-04-30 | ||||
| EPCS4SI8N | ALTERA/阿尔特拉 | 12+ | 1434 | 2026-04-30 | ||||
| W25Q128FVPIG | WINBOND/华邦 | 14+ | 74 | 2026-04-30 | ||||
| ATMEGA169PA-AU | MICROCHIP/微芯 | 18+ | 1008 | 2026-04-30 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| S25FL116K0XMFI010 | SPANSION/飞索半导体 | 15+ | 18 | 2026-04-30 | ||||
| SAA7115HL/V1 | NXP/恩智浦 | 08+ | 20 | 2026-04-30 | ||||
| TDA9885TS | PHILIPS/飞利浦 | 06+ | 178 | 2026-04-30 | ||||
| IL388DAA-00T | Infineon/英飞凌 | 02+ | 2300 | 2026-04-30 | ||||
| UPD7225GB-3B7 | NEC/日电电子 | 00+ | 90 | 2026-04-30 | ||||
| P89LPC933FDH | PHILIPS/飞利浦 | 04+ | 100 | 2026-04-30 | ||||
| MC33260DR2G | ONSEMI/安森美 | 08+ | 2000 | 2026-04-30 | ||||
| ST72F321J9T6 | ST/意法 | 06+ | 10 | 2026-04-30 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MAX8833ETJ+ | MAXIM/美信 | 08+ | 54 | 2026-04-30 | ||||
| MAX6364PUT29+T | MAXIM/美信 | 07+ | 185 | 2026-04-30 | ||||
| LM1084IT-3.3 | NS/美国国半 | 05+ | 500 | 2026-04-30 | ||||
| AZ431AZ-AE1 | BCD | 08+ | 1000 | 2026-04-30 | ||||
| MAX6007BEUR+T | MAXIM/美信 | 09+ | 1900 | 2026-04-30 | ||||
| BD9107FVM-TR | ROHM/罗姆 | 06+ | 1040 | 2026-04-30 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| CD74HC4066PWR | TI/德州仪器 | 06+ | 1000 | 2026-04-30 | ||||
| GRM31CR71E106KA12L | MURATA/村田 | 18+ | 1000 | 2026-04-30 | ||||
| C2012X7R1H104KT | TDK/东电化 | 08+ | 1400 | 2026-04-30 | ||||
| GRM21BR61E106KA73L | MURATA/村田 | 18+ | 3000 | 2026-04-30 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| N25Q128A13EF740E | MICRON/美光 | QFN | 17+ | 1015 | 2026-04-30 | |||
| NH82580EB SLH5Q | INTEL/英特尔 | BGA | 21+ | 67 | 2026-04-30 | |||
| PIC18F1330-I/SO | MICROCHIP/微芯 | SOP-18 | 23+ | 2825 | 2026-04-30 | |||
| LT3598IUF#TRPBF | ADI/亚德诺 | QFN | 23+ | 1450 | 2026-04-30 | |||
| TK16E60W.S1VX(S | TOSHIBA/东芝 | TO-220 | 21+ | 18000 | 2026-04-30 | |||
| WG82574IT SLBAC | INTEL/英特尔 | QFN64 | 22+ | 2768 | 2026-04-30 | |||
| PIC16F684-I/SL | MICROCHIP/微芯 | SOP | 21+ | 11400 | 2026-04-30 | |||
| PIC16F914-I/PT | MICROCHIP/微芯 | QFP | 21+ | 18293 | 2026-04-30 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| PIC16F684-I/SL | MICROCHIP/微芯 | SOP | 21+ | 11400 | 2026-04-30 | |||
| WG82574IT SLBAC | INTEL/英特尔 | QFN64 | 22+ | 2768 | 2026-04-30 | |||
| LT3598IUF#TRPBF | ADI/亚德诺 | QFN | 23+ | 1450 | 2026-04-30 | |||
| PIC18F1330-I/SO | MICROCHIP/微芯 | SOP-18 | 23+ | 2825 | 2026-04-30 | |||
| NH82580EB SLH5Q | INTEL/英特尔 | BGA | 21+ | 67 | 2026-04-30 | |||
| N25Q128A13EF740E | MICRON/美光 | QFN | 17+ | 1015 | 2026-04-30 | |||
| N25Q128A13EF740F | MICRON/美光 | QFN | 17+ | 1015 | 2026-04-30 | |||
| TPS61099DRVR | TI/德州仪器 | WSON6 | 24+ | 6000 | 2026-04-30 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| PIC16F914-I/PT | MICROCHIP/微芯 | QFP | 21+ | 18293 | 2026-04-30 |
